According to a new market research report "Thin Wafer Market by Wafer Size (125mm, 200mm, 300mm), Process (Temporary Bonding & Debonding, Carrier-less/Taiko Process), Application (MEMS, CMOS Image Sensor, Memory, RF Devices, LED, Interposer, Logic), and Region - Global Trend and Forecast to 2022", the thin wafer market was valued USD 6.76 Billion in 2015 and estimated to reach USD 9.17 Billion by 2022, at a CAGR of 3.7% between 2016 and 2022. Factors such as growth in the semiconductor industry, reduction in the size of electronic devices, growing mobile and consumer electronic markets, and high amount of material saving are key drivers for the growth of the thin wafer market.
The 300mm wafer is widely used in the manufacturing of semiconductor devices due to its high production capacity among all other wafers. This wafer size is expected to exhibit highest growth during the forecast period. It offers the ability to manufacture a large number of devices in a single batch. This is onecontinue reading →